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Resource Center

The Resource Center includes pertinent industry information, Frequently Asked Questions, White Papers, Industry Links, Industry Standards, and more.
White Papers

Correlation of Solder Joint Reliability of µPGA Socket To Package Flatness and PCB Warpage
Dr. Paul P.E. Wang, Shlomo Novotny, Keith Graveling, Damian Hujic, Dr. Dereje Agonafer and Wonkee Ahn.

A Study on Package Stacking Process for Package-on-Package (PoP)
Akito Yoshida, Jun Taniguchi, Katsumasa Murata, Morihiro Kada, Yusuke Yamamoto, Yoshinori Takagi, Takeru Notomi, Asako Fujit

Survey of Circuit Board Warpage During Reflow
Michael J. Varnau

Controlling bow and twist
Bob Willis

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