Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today's generation of TherMoiré product offerings serves as the platform for an enterprise-wide warpage management solution. Innovative developments in hardware, software and data management make the TherMoiré an essential value-added component for microelectronics manufacturing around the world.
Development / Diagnostics / Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction. Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability.
TherMoiré In-Process Warpage Measurement Systems
The substrate (PCB/chip-carrier/silicon/etc.) is literally the foundation upon which over 90% of value-added processing is performed in the microelectronics supply chain. Substrate flatness compliance is being driven by first pass yield objectives and uncompromising product reliability. Leading OEMs and contract manufacturers are achieving these objectives by introducing local area flatness specifications to compliment traditional IPC bow and twist allowances. Together, Akrometrix and its industry partners have successfully validated the importance of substrate flatness.
Akrometrix' LineMoiré product line enables manufacturers to cost effectively measure, analyze and react to board-to-board and lot-to-lot variations in substrate flatness. Whether in a stand-alone or in a high volume application, manufacturers receive real-time data to make substrate specific decisions (pass/fail), monitor trending (SPC), identify key correlations between flatness and assembly defects and enable traceability. All of these capabilities empower engineers and managers to better understand processes and materials, improve first pass yields and provide a definitive competitive advantage in the marketplace.LineMoiré Automated Flatness Inspection Systems: