OEM / ODM

95% of the world's largest semiconductor OEMs have used Akrometrix' equipment to help determine the impact that warpage has on their product offerings. Today, these OEMs are realizing a competitive advantage by introducing room temperature and temperature dependent flatness specifications to their supply base to directly improve assembly yields and product reliability.

Monitoring Vendor Quality (TherMoiré) - OEM/ODMs have to manage complex supply chains. Thermo-mechanical testing can double-check supplier performance against specifications, identify root cause and the responsible party when assembly problems arise, and predict reliability of the finished product.

Qualify New Designs (TherMoiré) - New PCB and package designs can be evaluated at the first article stage, thereby accelerating time-to-market and competitive position.

Mechanical Model Validation (TherMoiré) - Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. A measurement tool that provides feedback optimized for rapid comparison with simulation results speeds model development, confirmation of materials properties, and overall confidence in simulation results.