Semiconductor Assembly and Test (SAT) Applications

Advanced packaging designs are more than ever dependent upon mechanical integrity for effective level I and level II interconnect. Complex constructions of dissimilar materials alone account for significant losses due to die cracking, de-lamination, voiding, singulation and solder joint/bumping interconnect defects. Combine these with stacked package technologies and the impact can be exponential.

Prototype Qualification (TherMoiré) - By measuring thermo-mechanical performance at the first article stage, problems with new package designs can be identified, verified and documented before going into production, insuring customer specifications are being met. Accelerating the ramp to production can directly reduce NPI (new product introduction) costs and time-to-market for new products.

Assembly Yield and Reliability Investigation (TherMoiré) - Yield and reliability problems with a product already in production translate to increased costs as a result of waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage can assist in root cause analysis and identifying the responsible party in a complex multi-organization supply chain.

Sampling Thermal Warpage for Production QC (TherMoiré) - Even after the thermo-mechanical performance of the product design is qualified, good quality practice requires ongoing monitoring. Unexpected changes in materials and processes are more often the rule than the exception. Testing equipment capable of handling large numbers of samples quickly in a repeatable automated fashion can reduce inspection time and cost. Advanced software and data management tools provided by Akrometrix enable SPC monitoring, trending and traceability.

Mechanical Model Validation (TherMoiré) - Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. Akrometrix characterization solutions provide feedback optimized for rapid comparison with simulation results and can therefore speed model development, confirmation of materials properties and overall confidence in simulation results.

100% Incoming Inspection of IC Substrates (LineMoiré) - Organic and ceramic substrates are critical components in BGAs and other high performance packages. A warped substrate can fracture a chip during die attach or produce a final package that fails customer specs. Shadow Moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of incoming components.

Mid-process Inspection (LineMoiré) - Carriers (e.g. Auer boats) holding multiple singulated substrates can become warped themselves; individual packages can slip "out-of-pocket". Shadow moiré inspection can identify problems before they cause yield losses, equipment jams and line stoppages.

100% Final Inspection of Packaged Components (LineMoiré) - Inspecting finished packages can screen for molding problems, blistering, delamination, die tilt, improperly sealed lids and many other production problems. Shadow moiré-based LineMoiré systems offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of final products.

Please contact us if you have any questions or require a quotation.