Electronic Materials and Passive Components

Materials and their unique properties are the building blocks of all components and substrates in the microelectronics industry. A fundamental understanding of their impact on finished product constructions is paramount to achieving effective sensitivity analyses on related processes and substitutions.

Laminates and Pre-pregs (TherMoiré) - Laminate materials suppliers need to monitor the quality of their raw materials, including resins, fibers and foils. In addition, they need to correlate raw materials properties with composite performance and monitor outgoing product quality for their customers. Thermo-mechanical testing enables verification of the as-processed properties in ways directly applicable to final use.

Sockets (TherMoiré) - Sockets designed to hold high value IC packages are complex mechanical structures. Thermomechanical testing identifies potential interconnect problems before they create yield and reliability losses.

Connectors (TherMoiré) - Connectors are frequently the longest components attached to the assembly. They have complex mechanical structures with unreinforced polymer bodies and are subject to high thermomechanical strains. Bow along the long axis and CTE mismatch problems can be identified at the first article stage, thereby increasing customer satisfaction and reducing time-to-market.

Heat Sinks (LineMoiré) - Heat sink flatness is critical to optimal heat transfer away from the component. 100% inspection of heat sink mating surface flatness prevents performance problems and warranty repairs due to product overheating.